ZHANG, Yuanxiang. Electromigration Failure Prediction and Reliability Evaluation of Solder Bumps for FCBGA package. Engineering Transactions, [S. l.], v. 63, n. 2, p. 215–232, 2015. DOI: 10.24423/engtrans.272.2015. Disponível em: https://et3.ippt.pan.pl/index.php/et/article/view/272. Acesso em: 24 apr. 2025.